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PCB Design and Manufacturing

EIPEKS has been specializing in PCB development for over a decade. With our extensive expertise and resources, we fully support your projects. Whether analog or digital circuits, single-layer, double-layer, or multi-layer PCBs, we offer efficient， high-quality service from design to final production. Our main services include:

Schematic Design

PCB Layout and Routing

Mechanical Engineering and Design

Comprehensive Design Evaluation

Old Design Reverse Engineering

Manufacturing Documentation Preparation

Rapid PCB Prototyping

PCB Manufacturing and Assembly

Box Builds, Cable Assemblies, and Wire Harnesses

Home > PCB Design and Manufacturing

EIPEKS has been specializing in PCB development for over a decade. With our extensive expertise and resources, we fully support your projects. Whether analog or digital circuits, single-layer, double-layer, or multi-layer PCBs, we offer efficient， high-quality service from design to final production. Our main services include:

Schematic Design

PCB Layout and Routing

Mechanical Engineering and Design

Comprehensive Design Evaluation

Old Design Reverse Engineering

Manufacturing Documentation Preparation

Rapid PCB Prototyping

PCB Manufacturing and Assembly

Box Builds, Cable Assemblies, and Wire Harnesses

Standard PCB Development

The list here shows our standard PCB development capabilities, not our maximum potential. If your needs go beyond these specifications, please reach out to us.

Details of Standard PCB Development：

Materials

FR-4

370HR

Rogers

Nelco Buried Capacitance

FR406

FR408

Taconic

Polyimide

Teflon

Arlon

Hybrid FR-4 / Rogers

Layer Count

1 to 18 Layers

Minimum line spacing

0.003″

Material Thickness

0.002″ to 0.300″

Minimum Annular Ring

0.005″

Minimum drilled hole size

0.008″

Maximum board size

35″ x 46″

Maximum Copper Thickness

5oz.

Solder Mask

SMOBC, LPI or Dry Film

Finish Plating

HASL

Lead Free HASL

Immersion Silver

ENIG

ENEPIG

Matte Tin Plate

Soft / Hard Gold for Tabs and SMT

Selective Gold

Palladium

Silkscreen Colors

White

Yellow

Black

Solder Mask Colors

Green

Blue

Red

Black

Clear

Panelization

Green

Black

Panelization

Laser Vias

Tented Vias

Plated Slots

Edge Plating

Controlled Dielectrics

Conductive Filled Vias

Blind/Buried Vias

ITAR

Materials

FR-4

370HR

FR406

FR408

Nelco Buried Capacitance

Polyimide

FR408

Taconic

Hybrid FR-4 / Rogers

Layer Count

1 to 18 Layers

Minimum line spacing

0.003″

Material Thickness

0.002″ to 0.300″

Minimum Annular Ring

0.005″

Minimum drilled hole size

0.008″

Maximum board size

35″ x 46″

Maximum Copper Thickness

5oz.

Solder Mask

SMOBC, LPI or Dry Film

Finish Plating

HASL

Lead Free HASL

Immersion Silver

ENIG

ENEPIG

Matte Tin Plate

Soft / Hard Gold for Tabs and SMT

Selective Gold

Palladium

Silkscreen Colors

White

Yellow

Black

Solder Mask Colors

Green

Blue

Red

Black

Clear

Panelization

Routing

V-Groove

Other Services

Laser Vias

Tented Vias

Plated Slots

Conductive Filled Vias

Controlled Dielectrics

Edge Plating

Blind/Buried Vias

ITAR

Common PCB Substrates

FR-4, High Temp

Advantages:

High-Temperature Stability: It can operate at higher temperatures, making it suitable for high-temperature environments.
Cost-Effective: It is more affordable compared to other high-performance substrates.
Good Mechanical Properties: It offers high mechanical strength and toughness.
Widely Used: It is commonly used in various electronic devices with mature technology.

Disadvantages:

Lower Electrical Performance: Its electrical performance is lower compared to high-frequency substrates.
Thermal Expansion: It has a high thermal expansion coefficient, which can lead to heat management issues.
Moisture Absorption: It has high moisture absorption, which can affect electrical performance.

Rogers 3000 Series

Advantages:

Excellent Electrical Performance: Its low dielectric constant and low dielectric loss make it suitable for high-frequency applications.
Good Thermal Stability: It maintains stable electrical performance at high temperatures.
Low Dielectric Constant: It is suitable for high-speed signal transmission.

Disadvantages:

Higher Cost: It is more expensive compared to FR-4.
Processing Difficulty: It is more challenging to process and drill.

Rogers 4000 Series

Advantages:

Excellent High-Frequency Performance: Its low dielectric constant and low dielectric loss make it suitable for high-frequency and microwave applications.
Good Thermal Stability: It performs stably in high-temperature environments.

Disadvantages:

Higher Cost: It is more expensive compared to FR-4.
Processing Difficulty: It is more complex to process and handle than FR-4.

Rogers 5000 Series

Advantages:

Excellent High-Frequency Performance: It provides the best dielectric properties and low loss.
High Thermal Stability: It is suitable for extreme temperature conditions.

Disadvantages:

High Cost: It is one of the most expensive substrates.
Processing Difficulty: Advanced techniques are required for processing and drilling.

Teflon

Advantages:

Extremely Low Dielectric Constant: It is suitable for high-frequency applications.
Excellent Chemical Resistance: It has good resistance to various chemicals.
Low Dielectric Loss: It reduces signal loss.

Disadvantages:

Very High Cost: It is much more expensive compared to other substrates.
Processing Difficulty: Advanced techniques are required for processing and drilling.

TMM

Advantages:

Excellent Thermal Conductivity: It provides efficient heat management and is suitable for power-dense applications.
Stable Electrical Performance: It offers good electrical performance.

Disadvantages:

High Cost: It is more expensive than traditional substrates.
Complex Processing: It is more difficult to process.

Aluminum

Advantages:

Excellent Thermal Conductivity: It effectively dissipates heat and is suitable for high-power applications.
High Mechanical Strength: It has excellent mechanical strength.

Disadvantages:

Poor Electrical Performance: It is not suitable for high-frequency applications.
Higher Cost: It is more expensive than standard FR-4 substrates.

Arlon

Advantages:

Good High-Frequency Performance: It has a lower dielectric constant and loss factor.
Good Thermal Stability: It can withstand higher temperatures.

Disadvantages:

Higher Cost: It is more expensive compared to traditional FR-4.
Processing Difficulty: It requires advanced processing techniques.

Taconic

Advantages:

Excellent High-Frequency Performance: It has a low dielectric constant and low dielectric loss.
Strong Heat Resistance: It can work stably in high-temperature environments.

Disadvantages:

Expensive Price: It has a high cost.
Processing Difficulty: It is more complex to process and handle.

Polyamide

Advantages:

High Temperature Resistance: It has excellent high-temperature performance.
Good Mechanical Properties: It has high strength and good toughness.

Disadvantages:

Higher Cost: It is more expensive than standard FR-4 substrates.
Moisture Absorption: It may absorb moisture, affecting electrical performance.

PCB Development Process

Step 1

PCB Design

01

Schematic Design

Schematic Design

Our engineering team will carefully draw detailed CAD schematics based on your requirements, including all electronic component symbols and pad patterns, to ensure proper circuit connections. Then, we will review these schematics to verify the accuracy of layout constraints and data, ensuring that they can be correctly synchronized with the PCB layout database. Finally, we will format the schematics according to your document requirements and provide a traceable document that records all subsequent changes and revision history.

02

PCB Layout and Routing

PCB Layout and Routing

PCB layout and routing are key steps in turning the schematic into a physical circuit board. First, our engineering team will perform the component layout and arrange the electronic components on the circuit board to optimize space utilization and signal integrity. Next, we route the connections according to the schematic, ensuring signal paths meet design requirements and avoid interference and signal loss. Finally, we use design rule checking (DRC) to verify whether the routing meets the design specifications and manufacturing standards to ensure the reliability and effectiveness of the design.

03

Mechanical Design

PCB Layout and Routing

The mechanical design phase involves the design of the PCB shell and its integration with the overall equipment. Our mechanical engineering team designs shells, brackets, and other parts that fit the PCB. Through 3D modeling and simulation, we ensure that the design not only meets functional requirements but also optimizes heat dissipation, improves structural strength, and ensures compatibility with other components.

04

PCB Layout and Routing

Comprehensive Design Evaluation

After the PCB design is completed, we need to conduct a series of key evaluations to ensure the quality and manufacturability. First, we review the Bill of Materials (BOM) to verify that all parts match the design and that component pricing and availability meet requirements. Next, the Design for Manufacturing (DFM) review focuses on whether the component layout and routing are suitable for manufacturing processes, ensuring smooth assembly. Then, We perform a Design for Testability (DFT) review to verify the board’s testability, including built-in test points, test fixtures, and software to ensure correct assembly. Finally, the usability review checks for problems that may cause operational difficulties, such as unclear silkscreen markings or improper component placement. All problems found and suggestions will be reported to the customer to optimize the final design and improve production and use efficiency.

05

Old Design Reverse Engineering

PCB Layout and Routing

Step 2

PCB Manufacturing

01

Manufacturing Documentation Preparation

Manufacturing Documentation Preparation

During the manufacturing documentation preparation phase, we organize and format all design files needed for production. This includes generating detailed Gerber files, drill and pad layout files, schematics, assembly drawings, Bills of Materials (BOM), etc. Our team ensures that all files are accurate and meet manufacturing standards and specifications to support a smooth production process.

02

Rapid PCB Prototyping

Rapid PCB Prototyping

We provide rapid PCB prototyping services to verify and test design concepts in a short period of time. After completing the PCB design and circuit diagram, our engineers immediately conduct a detailed review of the Gerber files to ensure that their data is accurate and meets manufacturing standards. Once approved, we will quickly generate PCB prototypes through steps such as etching, drilling and lamination.

03

PCB Manufacturing and Assembly

PCB Manufacturing and Assembly

In the PCB manufacturing and assembly phase, we use advanced production technology and equipment to turn design files into actual circuit boards. Our process ranges from detailed review of design documents, PCB production (including pattern transfer, etching, drilling and lamination) to component mounting, soldering and final electrical testing. Through these precise steps, we ensure that each PCB is of high quality and reliability and meets strict performance and functional requirements.

04

Box Builds, Cable Assemblies, and Wire Harnesses

Box Builds, Cable Assemblies, and Wire Harnesses

We provide comprehensive design and manufacturing services for box builds, cable assemblies, and wire harnesses to achieve full product assembly and functional integration. Box builds include the entire device or system that is finally assembled, covering all electronic components, mechanical parts, and other related components to ensure that they can work in coordination and achieve the expected functions. Cable assemblies are composed of cables and connectors, which are responsible for connecting different electronic devices or systems. They focus on cable type, length, shielding, and connection method to ensure the reliability of signal transmission. Wire harnesses combine multiple cables and wires to simplify electrical connections, reduce clutter, and improve overall system reliability.

Application Areas

Consumer Electronics

Phone, TV, Computer, Tablet, Game Console

Military and Aerospace

Radar System, Satellite Communication Device

Industrial Control

Automation Equipment, Sensor, Control Panel

Instruments and Meters

Measuring Instrument, Testing Equipment

Communication Devices

Router, Switch, Wireless Base Station

Environmental Technology

Air Quality Monitor, Water Quality Tester

Medical and Health

Wearable Device, Electronic Pill Organizer, Thermometer, Monitor

Home Appliances

Refrigerator, Washing Machine, Microwave

Power Systems

Power Management System, Power Supply Equipment

Consumer Electronics

Phone, TV, Computer, Tablet, Game Console

Communication Devices

Router, Switch, Wireless Base Station

Environmental Technology

Air Quality Monitor, Water Quality Tester

Industrial Control

Automation Equipment, Sensor, Control Panel

Medical and Health

Wearable Device, Electronic Pill Organizer, Thermometer, Monitor, Medical Imaging Equipment

Military and Aerospace

Radar System, Satellite Communication Device, Aircraft Control System

Home Appliances

Refrigerator, Washing Machine, Microwave

Power Systems

Power Management System, Power Supply Equipment

Instruments and Meters

Measuring Instrument, Testing Equipment

Why Choose EIPEKS for PCB Development?

Flexible Orders and Fast Delivery

We promise to deliver projects within the scheduled time and provide flexible ordering options. You can determine the appropriate order quantity according to your needs.

Extensive Expertise and Experience

Our project team has successfully completed hundreds of PCB development projects. Our expertise covers all aspects, from schematics and layout to packaging and BOM.

End-to-End Solutions

We provide comprehensive PCB development services, including 3D design, hardware development, software development and embedded system development to to meet all your design needs.

Integrated Manufacturing and Assembly

Our manufacturing and assembly processes are integrated, avoiding DFM and DFA non-compliance issues caused by cooperation with multiple suppliers. This integrated approach ensures a seamless connection between design and production, reducing potential delays and errors.

How We Work With You

Preliminary Assessment

To better understand your project vision and needs, we will communicate with you in depth. After signing a non-disclosure agreement, our team will assess your project, gather your requirements, analyze market competitors, and develop a preliminary strategy.

Project Plan

Once project requirements are confirmed, we'll work with you to create detailed technical specifications, budget, and schedule. Our project team will conduct a comprehensive project assessment, refine resource allocation, and ensure the smooth progress of the project.

Development Phase

During the R&D phase, we will carry out component selection, schematic design, PCB layout design, and prototype production. At the same time, our technical team will carry out firmware development, 3D modeling, and simulation testing. We will also maintain regular communication with you to report on the project progress and adapt to any new requirements or goal adjustments.

Testing and Compliance

We will conduct rigorous testing to ensure that the product is error-free and meets industry standards. All tests will be conducted under real operating conditions, including those required for product certification. If problems are found, we will make the necessary modifications to resolve them and ensure product compliance.

Manufacturing Support

As your project moves to large-scale production, we'll provide full production documentation and technical support, including a detailed Bill of Materials (BOM). If needed, we can help you choose a suitable manufacturer and ensure a smooth production process.

Preliminary Assessment

Project Plan

Once project requirements are confirmed, we’ll work with you to create detailed technical specifications, budget, and schedule. Our project team will conduct a comprehensive project assessment, refine resource allocation, and ensure the smooth progress of the project.

Development Phase

Testing and Compliance

Manufacturing Support

As your project moves to large-scale production, we’ll provide full production documentation and technical support, including a detailed Bill of Materials (BOM). If needed, we can help you choose a suitable manufacturer and ensure a smooth production process.